Precision machining of single crystal diamond cutting tool via picosecond laser irradiation

Abstract

Due to its high hardness and excellent wear resistance, single crystal diamond has been widely applied in mechanical processing. However, the outstanding hardness leads to great difficulties in the machining of diamond by traditional strategies. In this study, a synchronous feed laser method is developed to realize low damage, high efficiency, and high precision machining of single crystal diamond cutting tools. The disadvantages of traditional direct laser machining, including fullerene residue, bending behavior, and the plasma-shield effect, are well avoided by the good control of the scanning path during the laser fabrication, which enlarges the entrance of the kerf and reduces the air pressure inside the kerf. The synchronous feed laser machining can realize the remarkable increase of kerf depth at high speed, as well as a minimum roughness of ∼147 nm on the cutting surface. It provides a novel, high efficiency, and high precision strategy for the preparation of high quality single crystal diamond tools.