Abstract

It is now a requirement in the semiconductor industry to prepare TEM specimens of pre-specified regions with a specimen preparation resolution exceeding 100nm. In other words, given the coordinates x, y, z of the location desired for TEM analysis, the TEM specimen preparation procedure must yield a thin TEM specimen containing the point x, y, z plus or minus 100nm. Preparation of failure analysis specimens in other fields of endeavor, such as: metallurgical, ceramic, composite material laboratories etc., have specimen preparation spatial resolution requirements below one micron in some cases with the likelihood that greater precision will be required in the future.

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