Abstract
Focused Ion Beam (FIB) milling has been widely used for the preparation of TEM specimens in both cross-section and plan view configurations. FIB induced damage is a non-negligible influence on making a thin and clear TEM specimen. Low-KV FIB is one of the solutions to reduce the ion beam damage created in current FIB operation system. An understanding of the type of FIB generated artifact on different materials is important to subsequent TEM analyses and to optimize the sample preparation process. In this paper, three types of materials, Si, ZnO and Cu have been selected to study the normal and low-KV FIB ion beam damage and the impacts for FIB prepared TEM specimens are compared.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
