Abstract

A mechanism of the photoresist shrinkage induced by electron-beam (EB) irradiation was studied in detail. A precise cross-sectional profile of a photoresist pattern is obtained by a scanning transmission electron microscope (STEM) after HfO2 atomic layer deposition on a sample. Photoresist lines and spaces formed on either of bottom anti-reflective coating (BARC) layer or spin-on-glass (SOG) layer were exposed to EB at a much higher dose than a practical dose (to accelerate shrinkage intentionally). The obtained STEM images of the patterns before and after EB irradiation showed that EB irradiation causes necking of the pattern profile as well as linewidth slimming. In addition, it was suggested that the BARC layer shrinkage results in the elastic deformation of the pattern profile, whereas the SOG layer does not shrink. Furthermore, EB irradiation only to the lines or spaces was performed. The EB irradiation to spaces caused sidewall shrinkage and necking of the pattern profile, although no electron was irradiated directly into the pattern. This result is considered to be due to the electrons scattered from the spaces to the pattern sidewall. Finally, a Monte Carlo simulation showed that the distribution of the deposited energy on the pattern surface corresponds to the change of the pattern shape. Consequently, our study clarifies the importance of the effect of elastic shape change and the impact of the electrons scattered from the underlying layer to the sidewall on photoresist shrinkage.

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