Abstract

Electrostatic discharge (ESD) can affect the performance of an electronic product and one of the ESD coupling paths to the electronic circuit is through the interfacing cables of the product. The first paper, “Extraction of a SPICE Model for Investigating the Cable Discharge Event in Flat Ribbon Cables Based on Transmission Line Theory,” develops a SPICE model for the cable discharge event (CDE) with specific focus on flat ribbon cables (FRCs), which are widely used in many electronic products. The proposed method can also be expanded to the other types of cables to evaluate CDE. With the equivalent circuit, it allows early evaluation of the product's ESD immunity before final design and compliance test.

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