Abstract
The Aerosol Deposition (AD) method has the unique property to allow for manufacturing dense ceramic films at room temperature. As found in many publications, the deposition process is very sensitive to powder properties. In particular, powders of nano-sized particles and grains, e.g., from precipitation, are usually beyond the conventional size range of AD processability, yielding chalk-like films of low mechanical stability. Thus, the conventional AD process is limited in applicability. In this study, we try to overcome this problem by adapting the standard milling treatment of powders for improved deposition by additional temperature pre-treatment. Using commercial tin dioxide and including a temperature treatment for grain growth, makes the powder accessible to deposition. In this way, we achieve optically translucent and conductive SnO2 thick films. With the application such as a gas sensitive film as one of many possible applications for SnO2 thick-films, the sensors show excellent response to various reducing gases. This study shows one exemplary way of extending the range of adequate powder and applications for the AD method.
Highlights
A coating technique that was developed recently is the aerosol deposition (AD) method using a room temperature impact consolidation process (RTIC) [1,2]
The AD process has the unique feature of room temperature processing of ceramic thick films
Since the powder properties such as particle size and morphology are decisive parameters for deposition success and film quality, we used a thermal pre-treatment to deposit nano-sized powders deposition success and film quality, we used a thermal pre-treatment to deposit nano-sized powders of tin (IV) oxide that lead untreated to a poor film quality
Summary
A coating technique that was developed recently is the aerosol deposition (AD) method using a room temperature impact consolidation process (RTIC) [1,2]. In the AD process, the powder is transferred into an aerosol by means of a carrier gas and transported to a vacuumed deposition chamber (some mbar) by a pressure difference. Besides process parameters like carrier gas composition [5], chamber pressure, nozzle geometry and particle velocity [6,7], the main influential film formation parameter is the powder itself. In most cases, it is characterized by the particle size and distribution of starting powder particles [1,4,8,9,10]. When only nano-sized powders are available, as for some materials, e.g., synthesized by precipitation route, resulting films are porous and chalk-like with insufficient mechanical stability [1], which means AD is not applicable for this material
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