Abstract
In order to achieve the aerosol deposition (AD) process as a thin film deposition process, the densification mechanism of the AD process was investigated. BaTiO3 films with thicknesses of 0.2, 0.5, and 2 μm on Cu substrates were fabricated using the AD process at room temperature in order to investigate the densification mechanism according to the increased the film thickness; we also investigated the resulting properties, including the microstructure, the electrical properties, and the hardness. As a result, we confirmed that the enhanced hammering effect (which is a densification procedure that works by continuous impaction of ceramic particles onto pre-impacted particles), formed dense BaTiO3 films with greater hardness and decreased leakage current characteristics. Furthermore, we concluded that the BaTiO3 particles, which were sufficiently fractured due to the hammering effect, were important in fabricating the dense BaTiO3 thin films. Therefore, we suggested the two-step deposition method (deposition and etching).
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
