Abstract

Metal matrix composite has been increasingly appreciated by many engineering applications due it its tailored properties for specific uses. Powder injection moulding is one of the most effective composite processing essentially for small and complex parts. Moulding of feedstock is the key step determining green and sintered properties. This research investigated effects of moulding parameters which are % solid loading and moulding speed on microstructure and properties of aluminium composite. Commercial aluminium alloy powder and SiC particulate at 15 vol.% addition were formulated at 55 % and 60 % solid loading. Injection moulding were operated using a horizontal screw driven typed machine at 1600-1800 rpm speed and 280 - 300 °C moulding temperature. After sintering at 655 °C, property assessment via microstructure, density, % shrinkage, distortion and hardness were carried out. It was found that feedstock of 55 % solid loading occasionally led to flash problem while that of higher solid loading experienced higher viscosity to fulfill four-cavity mould. Moulding speed investigated did not significantly affect mould filling and overall properties. Sintered microstructures generally showed well-distributed SiC particulate in the aluminium matrix. The optimum injection moulding condition was the feedstock prepared at 60% solid loading, moulding at 1800 rpm speed, which offered theoretical density of greater than 98.5 % and micro Vickers hardness of 125.2 Hv.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.