Abstract
Abstract Intrinsically conducting hot melt adhesives (ICHMAs) have been developed, based on polypyrrole (PPy) blends, for use in electronic and telecommunication applications requiring shielding against electromagnetic interference (EMI). These advanced materials have been formulated to exhibit significant EMI shielding effectiveness (SE) while retaining the superior properties of conventional hot melt adhesives. The conductivity properties, adhesion characteristics and both near- and far-field EMI SE behaviour of these ICHMAs at room temperature are investigated as a function of PPy content. The environmental stability of the conductivity is also reported. Potential use of such new materials in current and future electronic applications is anticipated.
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