Polypropylene Composites Reinforced by Nonmetallic from Waste Printed Circuit Boards Using Spout-Fluid Bed Coating with PP Particles Enhance Fluidization

Man Wu,Qingjie Guo,Xiude Hu,Henglai Xie,Cuiping Meng,Jingxia Jiang,Mingzhou Wu

doi:10.3390/polym13183106

Abstract

Nonmetallic materials recycled from waste printed circuit boards (N-WPCBs) were modified by coating KH-550 in a spout-fluid bed. To improve the effect of the modification, PP particles were used to enhance the fluidization quality of the N-WPCB particles in the coating modification. Then, the modified N-WPCBs were used as fillers to fabricate PP/N-WPCB composites. The method of coating in a spout-fluid bed with PP particles enhanced fluidization and showed the best modification effect compared to other coating methods. The FT-IR and SEM results demonstrated that interfacial bonding between N-WPCBs and PP could be enhanced by modified N-WPCBs, which improved the mechanical properties of the composites. When the mass ratio of PP to N-WPCBs is 100:75 and the dose of KH-550 is 4 phr, the flexural strength, tensile strength, and impact strength of the composites increase by 16.60%, 23.22%, and 23.64%, respectively. This would realize the high-value utilization of N-WPCBs with coating modification in the spout-fluid bed.

Highlights

Printed circuit boards are a typical and fundamental component of electronic products.Globally, waste electrical and electronic equipment are one of the fastest-growing waste sectors [1]
N-waste printed circuit board (WPCB) particles were modified by coating KH-550 in a spout-fluid bed
The modified N-WPCB particles were used as fillers to fabricate PP/N-WPCB

Summary

Introduction

Printed circuit boards are a typical and fundamental component of electronic products. Waste electrical and electronic equipment are one of the fastest-growing waste sectors [1]. The e-waste amount reached 53.6 million tons (Mt) worldwide in 2019, and the amount is projected to increase to 74.4 Mt by 2030 [2]. As the main component of e-waste, waste printed circuit board (WPCB) treatment has been a difficult and hot topic in the handling of e-waste. Previous research efforts have been put into the methods of separation and utilization of metal from WPCBs. the recycling of the nonmetallic fraction has become increasingly important due to its large volume and hazardous characteristics [3,4]

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