Abstract
Jettable fluid delivery and other microelectro mechanical (MEM) devices are becoming smaller in addition to being exposed to more extreme environments. These devices or packages rely on polymeric materials as structural adhesives for the assembly of various substrates. These polymer materials also provide protection from mechanical shock, extreme thermal cycles, and can withstand long exposure to the harsh chemical environment of the jetting fluids. Because these devices are becoming smaller, it is more difficult to accurately apply the structural adhesives. This poster will discuss an alternative adhesive format which is a very precise thickness film. These films are versatile and are designed with many physical and property options such as: supported or unsupported, thermally and/or electrically conductive, dielectric, low temperature attach and low voiding. In addition, the paper will describe the various film formats, film attach techniques and the part assembly processes.
Published Version
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