Abstract
AbstractThis article provides an overview on polymer/metal interconnection systems for microelectronics packaging. It will begin with a description of the functions of interconnection, and types of polymer/metal interconnection techniques available with tape automated bonding (TAB) being the most popular for chip connection applications. This is followed by examples of worldwide TAB applications and market outlook, TAB tape offerings and trends, as well as the entire TAB technology including tape types and fabrication, substrates interconnected by TAB, bonding techniques, TAB mounting options and TAB package encapsulation. Finally, future challenges on the most demanding fine-pitch TAB technology will be discussed.
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