Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation

Abstract

Thermal conductivity is critical to the stable operation, service life and reliability of electronic equipment. Solving thermal management problems in electronic devices requires the development of composites with high thermal conductivity. The interface between the filler and the matrix is formed due to the addition of the thermal conductive filler. The presence of interfaces greatly affects the heat transfer of composites. Therefore, it is a challenge to effectively control interface behavior and reduce interface thermal resistance. This review describes the mechanism of heat conduction and the theory of thermal conductivity of composites, and analyzes in depth the effect of interfacial thermal resistance on phonon heat transfer. The importance of improving the thermal conductivity of composites based on interfacial regulation strategies is illustrated from three aspects: non-directional structure design of fillers, co-doping of fillers and multi-layer structure design. Combined with the current research status, this review also describes the multifunctionality of thermally conductive composites. It is hoped that this review will provide some guidance for the study of polymer-based thermally conductive composites.