Abstract
Polyimides (PI) reinforced with cross‐linked organosilicon nanophase (ON), formed by the sol‐gel procedure, were characterized by wide‐angle and small‐angle x‐ray diffraction, thermogravimetric analysis, dynamic mechanical analysis, thermally stimulated depolarization current and dielectric relaxation spectroscopy. The ON proved to possess a rather loose inner structure characterized by the mean‐square electron density fluctuations. Thermal stability and thermomechanical properties of nanocomposites in the glassy state remained nearly the same as those of the pristine PI, while a significant reinforcement effect was observed for the rubbery PI matrix. Both a looser molecular packing of PI chain fragments adjacent to the ON and a loose inner structure of the spatial aggregates of ON were believed to be responsible for a non‐additive decrease of the experimental values of dielectric permittivity for the nanocomposites. The data obtained suggested a reasonably good potential of PI reinforced with the ON as low dielectric permittivity materials. In Commemoration of the Contributions of Professor Valery P. Privalko to Polymer Science.
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