Abstract
A polycondensation solid-state-reaction-based polyimide (PI) matrix has been used for composite material formation. Two types of PI matrix have been employed – a bulk PI system prepared by pressing a mixture of the powdered precursors (4, 4′-oxidianiline (ODA) and pyromellitic dianhydride (PMDA)) and a thin-film matrix formed by vapor co-deposition of the same precursors, PI monomers. A variety of different “guests” (trimethylaminalan, phthalocyanine, carbon) and the methods for their incorporation into the PI matrix are presented. The influence of the “guest” concentration and the thermal-treatment conditions on the surface morphology are shown and discussed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: Journal of Materials Science: Materials in Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.