Abstract
AbstractBoron nitride (BN) coated with sulfonated poly-arylene ether nitrile (SPEN) (BN@SPEN) was used as additive to enhance the thermal conductivity of polyarylene ether nitrile. BN@SPEN was prepared by coating BN micro-platelets with SPEN through ultrasonic technology combined with the post-treatment bonding process. The prepared BN@SPEN was characterized by FTIR, TGA, SEM and TEM, which confirmed the successful coating of BN micro-platelets. The obtained BN@SPEN was introduced into the PEN matrix to prepare composite films by a solution casting method. The compatibility between BN and PEN matrix was studied by using SEM observation and rheology measurement. Furthermore, thermal conductivity of BN@SPEN/PEN films were carefully characterized. Thermal conductivity of BN@SPEN/PEN films was increased to 0.69 W/(m⋅K) at 20 wt% content of BN@SPEN, having 138% increment comparing with pure PEN.
Highlights
The BN@sulfonated polyarylene ether nitrile (SPEN) was obtained by ultrasonic method combined with the post-treatment bonding process
The results indicate that the addition of BN was coated with SPEN (BN@SPEN) into the polymer matrix increases the thermal conductivity value of polyarylene ether nitrile (PEN) composite films obviously
Novel BN@SPEN/PEN composites with PEN as substrate and BN@SPEN as reinforcement were fabricated
Summary
R. Wei et al.: Polyarylene ether nitrile and boron nitride composites: coating with sulfonated polyarylene ether nitrile 71 electrical insulating composites [25,26,27]. There is still a challenge that BN and polymer matrix show good compatibility. The BN was firstly coated with sulfonated polyarylene ether nitrile (SPEN) offering BN@SPEN, and the BN@SPEN was introduced into polyarylene ether nitrile (PEN) matrix to obtain BN@SPEN/PEN composites. FTIR, TGA, SEM and TEM confirmed the preparation of BN@SPEN. The SEM and rheometer were used to study the compatibility between BN and PEN. Improved thermal conductivity of PEN was observed after the incorporation of the BN@SPEN.
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