Abstract
Dynamic mechanical properties of the poly (ether-ketone) (PEK) based nanocomposites reinforced with 0–30 wt% (0–20.2 vol%) SiO2 nanoparticles (20–40 nm) were investigated at 1 Hz over the temperature range of 30°C–250°C for the application in printed circuit boards/electronic substrates. It was found that uniform dispersion of SiO2 nanoparticles in the PEK matrix resulted in significant increase in storage modulus and microhardness. The highest increase in storage modulus measured at 50°C (glassy region) and 250°C (rubbery region) was more than 100% and 250% than that of neat PEK, respectively. The nanocomposites exhibited lower peak values of the tan δ than that of neat PEK. Scanning electron microscopy revealed good interfacial adhesion between the PEK matrix and the SiO2 nanoparticles which was validated by Kubat parameter. The glass transition temperatures determined from the loss modulus and tan δ are slightly increased for the nanocomposites. However, differential scanning calorimetry could not detect glass transition temperature.
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