Abstract
An amino-terminated oligoimide was prepared by Michael addition reaction of 1,1-(methylene-di-4,1-phenylene)bismaleimide (MDPBM) and 4,4′-diamino diphenyl methane (DDM) at MDPBM: DDM molar ratio of 1:2. The poly(amido-imide)s (PAI)s were prepared by condensation of this MDPBM:DDM oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, IR spectral studies, number average molecular weight (Mn) estimated by nonaqueous conductometric titration and thermogravimetry. The curing of epoxy resin namely: diglycidyl ether of bisphenol-A (DGEBA)-PAI system was monitored by Differential Scanning Calorimetry (D.S.C.). The glass and carbon fibre reinforced laminates of PAI-epoxy resin system have also been prepared and characterized.
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