Abstract
An amino-terminated oligoimide was prepared by the Michael addition reaction of 4, 4′-diamino diphenyl ether bismaleimide (DDEBM) and 4, 4′-diamino diphenyl methane (DDM) at a DDEBM:DDM molar ratio of 1:2. The poly(amido-imide)s (PAI)s were also prepared by condensation of this DDEBM:DDM oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, IR spectral studies and number average molecular weight ( Mn) estimated by non-aqueous conductometric titration. The curing behaviour of the diglycidyl ether of bisphenol-A (a commercial epoxy resin) (DGEBA)–PAI system was monitored by differential scanning calorimetry (DSC). Unreinforced PAI–epoxy cured products have also been prepared and analysed thermogravimetrically. Glass and carbon fibre reinforced laminates(i.e. composites) of the PAI–epoxy resin system have been prepared and duly characterized. Their mechanical properties have been compared with commercial composites.
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