Abstract
An amino-terminated oligoimide was prepared by Michael addition reaction of 1,6-hexane bismaleimide (HBM) and 4,4′-diamino diphenyl methane (DDM) at a HBM:DDM molar ratio of 1:2. The poly(amido-imide)s (PAIs) were also prepared by condensation of this HBM:DDM oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, infrared spectral studies, and number-average molecular weight ([Mbar] n ) estimated by nonaqueous conductometric titration. The curing behavior of diglycidyl ether of bisphenol-A (a commercial epoxy resin) (DGEBA) using the PAIs system was monitored by differential scanning calorimetry. The unreinforced PAI–epoxy-cured products have also been prepared and analyzed thermogravimetrically. From the curing temperature of DGEBA–PAI systems, the glass- and carbon-fiber-reinforced laminates (i.e., composites) based on these systems have also been prepared and characterized.
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