Polishing Material Effectiveness for Vertical Crown Tip by Lean Six Sigma DMAIC Approach

Abstract

Wafer sort is one of semiconductor test methodology. It uses an interface commonly known as probe card to perform electronic testing for semiconductor wafers. Probe card is classified into needle; one common class of probe card is vertical probe card, advance type. Needles or pins of the probe card are the one that make contacts with pads or solder bumps of the wafers. In this paper, DMAIC approach was utilized to analyse the most effective and compatible polish material which can be used for this type of advanced probe card. OEE (Overall Equipment Effectiveness) handled the monitoring of the pin's lifespan as well as pins replacement. On the other hand, Process Control Plan covered the monitoring of changing frequency of polish materials. The concept of this study can be used as a guide in analysing the other types of advanced probe card and polish materials in different semiconductor industries worldwide.