Abstract
ABSTRACTPlasma modification of SiOCH low-k films is analyzed by means of Molecular Mechanics. It is shown that the most probable mechanism of SiOCH modification in He plasma is removal of hydrogen atoms from CH3 groups. The change of Si–O–Si bond angles depends on the amount of the formed –CH2* (CHx) groups. During the followed exposure in NH3 plasma, NH2* radicals bind CHx groups with Si forming a –CH2– Si–O–Si–O–Si–O–Si– chain. The end of this chain gets bound to its beginning through NH2. This process is the reason of pore sealing.
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