Abstract
The use of optical interconnections for communicating between chips or boards of a computer has been hampered by the lack of practical packaging schemes for free-space optics. In order to solve this problem, the concept of "planar optics" was proposed. This approach is based on the use of computer aided design and standard fabrication techniques adapted from semiconductor processing. Microoptical components are placed on the surfaces of a single optical substrates. Optoelectronic chips are integrated using hybrid techniques such as flip chip solder bump bonding. In this review article, we present the idea of planar optics, show several demonstration experiments, and discuss various aspects related to manufacturability. For our considerations, emphasis will be put on interconnection applications.
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