Hybrid packaging of surface-emitting microlaser arrays on planar optical systems

Abstract

Microoptic technology offers a possibility to solve the problems that are associated with conventional opto-mechanics. These are large size, high cost, difficult alignment and sensitivity to mechanical and thermal influences. In order to overcome these problems, the concept of "planar optics" has been suggested where microoptic components are integrated on a single substrate using a two-dimensional layout. The integration of device chips on the optical component substrate is achieved by hybrid techniques such as flip-chip bonding. An array of gallium arsenide surface-emitting microlasers integrated with a planar optical imaging system is reported. We discuss fabrication issues concerning the bonding and applications of such a hybrid structure for free-space optical interconnects.