Abstract
This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 \(\upmu \)m and 130 \(\upmu \)m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors.
Highlights
The Large Hadron Collider (LHC) at CERN will undergo major improvements during what is called Long Shutdown 3 (LS3), presently foreseen for years 20242026
This paper reports on the Institute for Nuclear Physics (INFN) (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades
The pixel sensors in the INFN R&D have been designed following the above requirements, for both planar and 3D columnar devices, going through different steps and production batches at FBK foundry to optimize the various production processes in order to identify the best candidates for the HL-LHC pixel detector upgrades
Summary
The Large Hadron Collider (LHC) at CERN will undergo major improvements during what is called Long Shutdown 3 (LS3), presently foreseen for years 20242026. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors.
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