Abstract

Charge trapping defects in high- $\kappa$ dielectrics and at their interfaces are known to be a challenging obstacle for the silicon based modern transistors. To facilitate the solution of such problems, a deeply physical understanding of the charge trapping process at atomistic scale is mandatory. As such, we propose, for the first time, a direct method to calculate the exact hole trapping rates explicitly in the high- $\kappa$ gate stack consisting of silicon channel, SiO 2 interfacial layer and HfO 2 . The physics of multiple-path (by trap locations) hole trapping processes is revealed by combining density-functional theory and Marcus theory. The roles of physical quantities including defect reorganization, coupling constant and Gibbs free energy are discussed. It is suggested that oxygen vacancies at high- $\kappa$ interface with interfacial layer SiO 2 are dominant hole traps under NBTI stress. The developments and findings provide not only a deep physical insight into the hole trapping related reliability degradation mechanism, but also a new simulation framework.

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