Abstract
Composite solder has gained researcher’s attention due to its promising improvement in physical and mechanical properties for lead-free solder. To improve the properties of Sn-3.0Ag-0.5Cu (SAC) with the promising lead-free candidate, addition of silicon carbide (SiC) as a reinforcement was used in this study. This study was carried out to identify the effect of SiC particle on microstructure evolution and physical properties of SAC based solder alloys. SAC-SiC composite solder was synthesized by powder metallurgy method (PM), which consists of several processes such as mechanical blending, compaction and sintering. Three different weight percentages of SiC particles; 0.00, 0.50, and 1.00 were mechanically blended with SAC lead-free solder. The results show that the additional of particle SiC was able to refine the microstructure and reduced the size of β-Sn.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
