Photonic bandgap surfaces with interdigitated corrugations

Abstract

For a given operational frequency, the unit cell surface area of a metallo–dielectric photonic bandgap structure (MBPG) is reduced by increasing the capacitance between adjacent unit cell elements. An MPBG structure possessing interdigitated corrugations is proposed in order to achieve this increase. The structure is incorporated, as the ground plane, in a microstrip transmission line and it is experimentally characterised over the 50 MHz–4 GHz frequency band.