Abstract

Deposition of Y on the Cu(1 0 0) surface at room temperature has been studied by X-ray photoelectron spectroscopy, ultraviolet photoelectron spectroscopy and work function measurement. The formation of a relatively thick mixed interface, > 100 Å, is observed. The Y/Cu atomic ratio of the mixed interface is found to be about 1:3 at the Y coverage of 2.0 ML. Based on the YCu phase diagram we suggest that an intermetallic compound YCu 3 is formed in the top layer of the interface in the range of 0.8–2.0 ML. For the coverage more than 2.0 ML, the Y atoms are stopped to diffuse into the intermetallic compound and form a yttrium layer on it.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call