Abstract
Hydrogen-terminated porous Si wafers with (100) and (111) oriented crystal planes were fabricated through a photo-electrochemical etching. It is found that the porosity of silicon wafers and their etch rates are determined as a function of crystal orientation. Due to the anisotropic etching behavior of single-crystal silicon, the hydrogen-terminated porous Si (100) wafers exhibit not only more excellent photodegradation activity but also stronger stability for methyl orange degradation than hydrogen-terminated porous Si (111) wafers under visible light irradiation. For the unetched Si wafers, however, the photodegradation activities of methyl orange exhibit a contrary conclusion.
Published Version
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