Abstract
Potential candidates for thin-film diffusion soldering were investigated by analysis of phase formation and measurements of mechanical and thermal stability of thin-film bonds. Bilayers of Pt/In, Pd/In, and Zr/Sn of 500 nm/500 nm thickness were prepared by direct current magnetron sputtering followed by a 5 nm, thin protective Au layer. Single bilayer samples were heat-treated between 200°C and 500°C for 3–30 min and studied by x-ray diffraction (XRD) analysis. Some bilayers were bonded face-to-face between 300°C and 500°C for 3–30 min and sheared-off either in shear-strength measurements at room temperature or in remelting experiments up to 1,100°C. Phase formation in Pd/In and Pt/In thin films is much faster than in Zr/Sn thin films. An interaction of Au in addition to a questionable thermal stability of PtIn2 complicated the reaction in Pt/In samples. A revised partial Pd-In phase diagram was constructed, correcting the compound ‘PdIn3’ to Pd3In7. The Pt/In and Pd/In thin-film systems are very promising candidates for thin-film diffusion soldering.
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