Phase-change materials for thermal management of electronic devices

Abstract

The increase in power density of electronic devices, driven by the higher performance and miniaturization demands, has led researchers seek new and alternative thermal management techniques. Since most of the electronic devices often experience high frequency power cycles, cooling systems must also be capable of managing transient thermal profiles to delay the temperature response and reduce the temperature gradients within the device, which can cause thermal stresses and, in the long run, the failure of the electronic device. The integration of Phase-Change Materials (PCM) into heat sinks for electronic devices represents an interesting technique to increase the thermal inertia of the cooling system, while also ensuring more stable operating temperatures within the electronic components. However, several technical challenges still limit their commercial viability in electronic applications. The present paper critically discusses the latest research trends in this field, with a special focus on electric batteries, power electronic and portable device applications. Methods to enhance PCM-based heat sinks for electronic devices are also discussed. Generally, integrating PCMs into the thermal management system of electronic devices is an effective technique to reduce hot spots (between 6%–10%) and have a more uniform temperature distribution inside the component. However, more experimental research is needed to test their suitability over extended usage period and to establish practical design procedures. • Integration of PCMs in electronic devices can reduce temperature hot spots by 6%–10%. • PCMs are effective for the thermal management of EV batteries. • Microencapsulated PCM thin-film layers can be integrated in portable devices. • The use of porous media and metal foams can enhance the performance. • More experiments are needed to fully characterize PCMs in electronic applications.