A polyurethane solid–solid phase change material for flexible use in thermal management

Abstract

Phase change materials (PCMs) have received great attention in thermal management of electronic devices due to their high energy storage density and no need for additional energy supply. Yet the leakage problem after phase change limits their application greatly. In this paper, the block copolymerization was used to prepare a novel solid–solid phase change material (SSPCM) with a melting enthalpy of 90.26 J/g, starting pyrolysis at a temperature of more than 300 °C, and its physicochemical and thermal properties remained basically unchanged after 100 heating/cooling cycles. Notably, this SSPCM has excellent shape stability and can be pressed into phase change film with flexibility, thermally induced self-healing capability and recyclability. Finally, we innovatively combined this SSPCM, copper foam (CF), and polyimide tape (PI) to obtain a composite phase change material (CPCM) with both high thermal conductivity (1.1994 W/m·K) and high electrical insulating properties. Thermal management experiment shows that this CPCM has good thermal management performance and can significantly reduce the temperature rise rate of the simulated CPU. The SSPCM prepared in this study shows great potential for application in thermal management of portable electronic devices and flexible wearable electronic devices.