Performance of Sodium Dodecyl Sulfate in Slurry with Glycine and Hydrogen Peroxide for Copper-Chemical Mechanical Polishing

Abstract

The performance of sodium dodecyl sulfate (SDS), an anion surfactant, in a slurry with glycine and hydrogen peroxide for copper-chemical mechanical polishing (Cu-CMP) was studied. The wettability and surface tension of the slurry for copper and the zeta potential of were examined. The influence of SDS on the static corrosion, material removal rate, and the surface roughness was studied. The results showed that SDS improved Cu-CMP performance by changing the physical characteristics of the slurry and protecting the copper surface from corrosion and scratches. A surface with the lowest amount of scratches and corrosion after polishing was obtained when concentration of the SDS surfactant was in the glycine– solution. The mechanism of action between the SDS and copper surface was investigated by electrochemical polarization and X-ray photoelectron spectroscopy. Finally, a physical model was developed to describe the interactions between particles, the copper surface, and SDS in the slurry.