Abstract
ABSTRACTThree-dimensional light-emitting diodes (LEDs) are the preferred light source for bulb lamps due to their 360° illumination. Addition curing silicone resins have usually been used to encapsulate LEDs. LED-filament encapsulation needs silicone resins having high thermal performance and thixotropy. Herein, a low refractive index and highly anti-thermal aging silicone oil was synthesized by hydrolysis and co-condensation method, and used to prepare an encapsulation material for high-power LED-filament. The cured silicone materials were characterized by thermogravimetric analysis (TGA) and thermal aging test under 180°C and 250°C. The results demonstrated that the thermal stability of the cured silicone resins with short-chain phenyl silicone as a crosslinker was higher than that with long-chain methyl silicone oil crosslinker. Owing to the excellent thermal stability, appropriate hardness, high transparency and photoelectric efficiency, this LED encapsulation material is a promising candidate for high-power LED package.
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