Performance of a flat grooved heat pipe with a localized heat load

Ramazan Aykut Sezmen,Barbaros Çetin,Zafer Dursunkaya,F Bakir,S Kouidri,R Bennacer

doi:10.1051/e3sconf/202132104010

Ramazan Aykut Sezmen, Barbaros Çetin + Show 4 more

Open Access

https://doi.org/10.1051/e3sconf/202132104010

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Abstract

Heat pipes are phase change heat transfer devices used in wide range of heat transport applications due to their high thermal transport capacities with low temperature differences. Heat pipes are especially preferred for electronic cooling applications and aerospace avionics to satisfy high heat transfer rate requirements. In this study, heat transfer and phase change mechanisms of working fluid are investigated and modeled using a 3-D thermal resistance network for multichannel flat grooved heat pipes. First, heat transfer and fluid flow are modeled in half of a single grooved structure due to symmetry, and is subjected to uniform heat flux. Radius of meniscus curvature and temperature distribution along the groove are calculated. Results are compared with experiments in the literature and show good agreement. The validated heat transfer and fluid flow models are extended to a multichannel model to observe performance of grooved heat pipes with localized heat sources, not covering the entire width, a vital feature for realistic simulation of operational devices. Predictions of the temperature distribution along the multichannel of the heat pipe are provided and the effect of the distribution of heat sources on the heat pipe is discussed.

Highlights

By the recent advances in technology, electronic components are getting smaller in size, and the corresponding power dissipated is getting higher and it becomes an important and critical issue for the proper utilization of these devices
Besides traditional heat transport devices and methods, heat pipes have been considered as a favorable alternative [1] for thermal management of electronic components [2] and in space applications [3], heating, ventilating and air-conditioning systems [4] and nuclear applications [5]
Do et al [6] developed a mathematical model for predicting the thermal performance of a flat micro heat pipe with a rectangular grooved wick structure

Summary

Introduction

By the recent advances in technology, electronic components are getting smaller in size, and the corresponding power dissipated is getting higher and it becomes an important and critical issue for the proper utilization of these devices. Various studies have been done to predict the thermal performance of flat grooved heat pipes that suggest different phase change, flow and heat transfer models. Lefèvre et al [7] developed a two-phase flow model and resistance network based thermal model to calculate the liquid and vapor pressures and velocities, the meniscus curvature radius and the temperature in the heat pipe container from the source to the sink region. A 3-D thermal resistance network accounting for both the axial and transverse conduction heat transfer and a 1-D simplified flow model are developed and combined to obtained vapor temperature, contact angle and temperature distribution over the flat grooved heat pipe. After the validation of the developed model for the uniformly distributed heat load, thermal resistance network is extended to allow the simulation of the performance of flat grooved heat pipes under non-uniform heating and cooling conditions. The effect of localized heat sources and heat sinks can be observed by applying the relevant boundary conditions to the corresponding nodes

Heat transfer modeling

Flow modeling

Validation of the developed model

Extended multichannel model

Results and discussion

Conclusions