Abstract

A detailed Sentaurus TCAD simulation based study for Silicon Double Gate Tunnel Field Effect Transistor (Si-DG TFET) based Ring Oscillator (RO) is presented in this work. Two different ring oscillator topologies (simple RO and Negative Skewed Delay RO )are presented with two different structures for TFET device. The two structures are different in the source-drain extension regions widths. The extension region width variation effects are studied and presented for inverter and ring oscillator. A TFET based inverter is presented to show the changes in behavior due to variations in the drain extension region widths, which is later used for RO designs. The drain extension region width changes the drain extension region resistances which in turn is responsible for change in the corresponding device properties. RO simulation are used for calculating the delay. To further explore digital and analog applications transfer characteristics and noise margins of inverter are explored with power supplies variations. Better reliability for oscillation frequency is obtained using Negative Skewed Delay ring oscillator (NSD RO) topology. NSD RO is resulting in lesser jitter, more reliable frequency as compared to single-ended ring oscillator topology. By tuning the supply voltage of the device the ring oscillator frequency can be used for RF applications, thus it works like a voltage controlled oscillator (VCO).

Highlights

  • The conventional device metal-oxide-semiconductor fieldeffect transistors (MOSFET) is saturated before further scaling due to its short channel effects, high leakage current etc

  • It is found that the frequency of operation in case of NSD Ring Oscillator (RO) is 3.65X times of the simple single ended RO, this happens because the amplitude of sinusoidal wave generated by Negative Skewed Delay ring oscillator (NSD RO) is 60% of its power supply as shown in Fig 13b while in case of simple RO it is 150% of the power supply

  • Tunnel FET based ring oscillator (RO) study is presented with drain extension region width and power supply variations of SiDG tunnel field-effect transistors (TFETs)

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Summary

INTRODUCTION

The conventional device metal-oxide-semiconductor fieldeffect transistors (MOSFET) is saturated before further scaling due to its short channel effects, high leakage current etc. In this work an inverter is prepared to see the effects of source/drain extension width changes and it is used for ring oscillator design. Is going on towards a low cost solution for frequency generator on the chip and one of such solution is RO, which can be fully fabricated along the chip and the output frequency can be tuned with variations in the supply voltage, it works like voltage control oscillator (VCO). Focus is on RO design and analysis with different parameters of the device or the supply voltage, like- the effect of drain extension region widths of Tunnel FET has been studied for the inverter DC, Voltage Transfer Characteristics (VTC), and transient characteristics, and for ring oscillator application as well.

SIMULATION SETUP AND TFET DEVICE CALIBRATION
INVERTER ANALYSIS
Static Transfer Characteristics
Voltage Transfer Characteristics
Transient Characteristics
RING OSCILLATOR APPLICATION
Findings
CONCLUSIONS
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