Abstract
Optical interferometry plays an important role in the topographical surface measurement and characterization in precision/ultra-precision manufacturing. An appropriate surface reconstruction algorithm is essential in obtaining accurate topography information from the digitized interferograms. However, the performance of a surface reconstruction algorithm in interferometric measurements is influenced by environmental disturbances and system noise. This paper presents a comparative analysis of three algorithms commonly used for coherence envelope detection in vertical scanning interferometry, including the centroid method, fast Fourier transform (FFT), and Hilbert transform (HT). Numerical analysis and experimental studies were carried out to evaluate the performance of different envelope detection algorithms in terms of measurement accuracy, speed, and noise resistance. Step height standards were measured using a developed interferometer and the step profiles were reconstructed by different algorithms. The results show that the centroid method has a higher measurement speed than the FFT and HT methods, but it can only provide acceptable measurement accuracy at a low noise level. The FFT and HT methods outperform the centroid method in terms of noise immunity and measurement accuracy. Even if the FFT and HT methods provide similar measurement accuracy, the HT method has a superior measurement speed compared to the FFT method.
Highlights
The peak position of the coherence envelope can be obtained at N = 1000, corresponding to 30 μm surface height for a scanning interval of 30 nm
The centroid method can average noise at the step edge, thereconstructed reconstructedsurface surfaceprofile profileisis still still slightly average out out the the noise at the step edge, the can average out the noise at the step edge, the reconstructed surface profile is still slightly distorted
Three kinds of fringe analysis algorithms based on the centroid method, fast Fourier transform (FFT), and
Summary
Optical interferometry is widely regarded as a powerful tool for topographical surface metrology due to its significant advantages of non-contact operation, high accuracy, and high resolution [1,2,3]. It has been gaining great importance for the manufacturing of high value-added components, such as freeform optical elements [4,5,6,7], micro-electromechanical-systems (MEMS) [8], microstructures [9,10], and transparent thin films [11].
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