Abstract
Negative capacitance (NC) effect in nanowire (NW) and nanosheet (NS) field effect transistors (FETs) provide the much-needed voltage scaling in future technology nodes. Here, we present a comparative analysis on the performance of NC-NWFETs and NC-NSFETs through fully calibrated, three-dimensional computer aided design (TCAD) simulations. In addition to single channel NC-NSFETs and NC-NWFETs, those, with vertically stacked NSs and NWs, have been examined for the same layout footprint (LF). Results show that NC-NSFETs can achieve lower subthreshold swing (SS) and higher ON-current (I ON ) than NC-NWFET of comparable device dimensions. However, NC-NWFETs show slightly higher I ON /I OFF ratio. Negative differential resistance (NDR) is found to be more pronounced in NC-NSFET, enabling these devices to attain a stronger drain-induced-barrier-rising (DIBR) and steeper SS for gate lengths as small as 10 nm. The results presented here can, therefore, provide useful insights for performance optimization of NC-NWFETs and NC-NSFETs, in ultra-scaled and high-density logic applications, for 7 nm and beyond technology nodes.
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