Abstract

This paper proposes a current sensor for wide bandgap (WBG) devices. The current of a power semiconductor device is mainly measured using a Rogowski coil, an active current transformer, and a coaxial shunt resistor. The Rogowski coil and active current transformer are not suitable for the current measurement of surface mount WBG devices due to their operating principle. The coaxial shunt resistor causes parasitic inductance. Since WBG devices are more sensitive to parasitic inductance than silicon devices, parasitic inductance may affect circuit operation. To overcome these problems, this paper proposes a printed circuit board (PCB)-embedded spiral pattern pick-up coil current measurement for WBG devices. The proposed pick-up coil has high mutual inductance compared to the conventional pick-up coil, so the measurement sensitivity is high. In addition, there is no need for additional processing outside the PCB. Experimental results using a double pulse tester circuit are provided to verify the performance of the proposed current sensor.

Highlights

  • In the power converter circuit, the current measurement of power semiconductor devices is required for feedback control, fault detection, and soft switching

  • Rogowski coil [1,2] is a current sensor based on electromagnetic induction

  • This paper proposes a printed circuit board (PCB)-embedded spiral pattern pick-up coil current measurement for wide bandgap (WBG)

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Summary

Introduction

In the power converter circuit, the current measurement of power semiconductor devices is required for feedback control, fault detection, and soft switching. PCB pattern-based pick-up coil current measurement methods that minimize parasitic inductance and have a wide bandwidth have been proposed [5,13,14,15]. The proposed pick-up coil is embedded in the PCB, and the current path of the device to be measure is configured outside the PCB to surround the pick-up coil This method has the advantage of high magnetic flux linkage to the coil and high measurement sensitivity. Since the current path is exposed to the outside, an insulator should be added between the current path and the pick-up coil, and an additional manufacturing process is required To overcome these problems, Wang et al [5] proposed a method of configuring a pick-up coil next to the device to be measured. The measured current waveforms with the proposed pick-up coil and shunt resistor are compared

Current-Measurement Principle
Pick-Up
The mutual inductance is issimulated
Mutual Inductance Analysis
Analysis According to Layer Composition
Analysis According to Coil Pattern Configuration
Proposed
Pick-up Coil Equivalent Model and Integration Circuit
12. PCB-embedded
Experimental Verification
15. Double-pulse
16. Overall
17. Transient
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