Abstract
Power semiconductors based on wide bandgap (WBG) devices are capable of fast switching and have low on-resistance. Accordingly, a fast sensor with a higher bandwidth is required for circuit inspection based on switch current measurements. Thus, it is necessary to have a current sensor in the printed circuit board (PCB) circuit for diagnosis and protection of the surface mount device (SMD) type circuit system. Accordingly, a pickup coil with the advantages of a high degree of sensor configuration freedom, wide bandwidth, and low cost can be a good alternative. This study analyzes the influence of coil shape and parameters on sensor design as a guideline for embedding a pickup coil in an SMD-type PCB circuit of a WBG power semiconductor-based, half-bridge structure. The mutual inductance and self-inductance values of the coil are considered large variables in the design of a sensor coil for simultaneously maintaining high bandwidth and sensor sensitivity. Therefore, magnetic and frequency response analyses were conducted to verify the correlation with inductance, the influence of coupling capacitance, and the influence of the magnetic field formation via the current flowing through the external trace inside the PCB. The coil model is verified and discussed through simulation and double pulse tests.
Highlights
A system that includes a power semiconductor based on a wide bandgap (WBG)device has the advantages of high di/dt, dv/dt, efficiency, and a fast-switching speed, compared to conventional silicon devices [1,2]
As the pickup coil A is located inside the printed circuit board (PCB) as shown in Figure 12, in case the current flows through the external trace inside the PCB as shown in Figure 12, in case the current flows through the external trace located at the distance of x and height y from the pickup coil, the external magnetic flux located at the distance of x and height y from the pickup coil, the external magnetic flux can pass through the closed-loop area of the coil
Analysis was focused on five coil models that could be configured according to the number of conductors located adjacent to the coil, the area of the coil incident surface through which the magnetic flux passes, the distance between the coil and conductor, the number of turns of the coil, and the influence on the presence of an external magnetic flux
Summary
Device has the advantages of high di/dt, dv/dt, efficiency, and a fast-switching speed, compared to conventional silicon devices [1,2]. The shape of the Rogowski coil and the different design structures in the PCB circuit can have a significant influence on the bandwidth, sensitivity, and external noise that appear through different magnetic properties. It is impossible to embed a conventional toroidal-type Rogowski coil in a PCB, including a non-modular power converter; a pickup coil was proposed in [30,31,32,33,34]. This study analyzes the influence of external wires on the sensor in the PCB and the influence of coil parameters for a pickup coil configuration that measures the switch current in a half-bridge structure system, employing a non-modular WBG power semiconductor. The process of analyzing the mutual inductance is performed by comparing the magnetic flux and bandwidth between the five pickup coil models according to the configurable coil and conductor shape.
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