Abstract

With the advancement of electronic devices, the generation of heat and electromagnetic (EM) waves has increased. Therefore, it is essential to properly manage these heat and EM waves, while ensuring the flame retardancy and mechanical properties of the materials used in these devices. In this study, to compensate for the low thermal and electrical conductivity of Poly(p-phenylene-2,6-benzobisoxazole) (PBO), which was used as the matrix, reduced graphene oxide aerogel (rGOA) with high electrical conductivity and electromagnetic interference shielding effectiveness (EMI SE) performance and boron nitride (BN) with high thermal conductivity were selected as fillers (rGOA/BN). To significantly improve the compatibility of the filler with the matrix, PBO fiber was grafted onto the rGOA/BN filler. The fabricated composites exhibited high electrical conductivity of 21.1 S/cm and thermal conductivity of 4.81 W/m∙K, and the EMI SE and tensile strength were improved to up to 78.42 dB and 201.8 MPa, respectively.

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