Abstract

When fabricating inkjet-printed electronic devices and circuits, inkjet-printed conductive materials require drying and sintering to improve electrical conductivity. Electrical conductivity should be the same irrespective of pattern design, size, location, or density of adjacent patterns. However, we demonstrate that spatial variations in the drying process for inkjet-printed patterns with proximity to others cause resistivity variations. These resistivity variations are studied here experimentally for different circuit patterns and in arrays of inkjet-printed square electrodes. This variation depends not only on the location of each electrode in an array but also on the number of electrodes. This means that for the same drying temperature and duration, the array with a larger number of electrodes exhibits a larger resistivity variation. The sooner an electrode dries, the lower resistivity it achieves. The resistivity variation between an individual electrode and the center electrode in a 7 × 7 electrode array can be a factor of seven. This variation decreases for lower numbers of electrodes to a factor of three for a 3 × 3 array. Furthermore, x-ray photoelectron spectroscopy analyses provide evidence for the residual presence of carbon-based materials within electrodes after the drying process. These results confirm that the location of electrodes within an array significantly influences the amount of residual carbon-based materials, thereby contributing to resistivity variations. Although intense pulsed light sintering can decrease this variation, its optimal parameters depend on the printed designs, and our simulation results show a non-uniform temperature profile over the electrode arrays. Temperature increases more at the center of patterns than the corners, which can be useful in this case to improve resistivity uniformity. In this study, for the first time, we show how different printed shapes and designs can result in non-uniform resistivity after drying and sintering.

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