Abstract
Abstract The preparation of metallographic sections from soft metals such as pure copper constitutes a particular challenge: the high degree of ductility promotes the formation of preparation artifacts and complicates the preparation of homogeneous, low-deformation surfaces. A metallographic preparation routine is therefore presented which has proven effective for pure copper and which can also be applied to additionally soft annealed samples. The subsequent removal of fine crystalline deformation layers is discussed and different setups for electropolishing and its optimization are presented.
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