Abstract
This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.
Highlights
S UITABLE antenna-in-package technologies for D-band applications are, for example, low temperature co-fired ceramics (LTCC) [1], integrated passive devices (IPD) [2], and thin-film processing on alumina substrate [3]
The cavity-backed design is beneficial for heat dissipation [12], which may become an issue in future D-band phased antenna arrays due to significant amount of power dissipated on a small printed circuit board (PCB) area
We present D-band patch antenna and 4×4 array designs on a cost-effective and low-loss multilayer build up which can be manufactured using PCB processing techniques
Summary
S UITABLE antenna-in-package technologies for D-band applications are, for example, low temperature co-fired ceramics (LTCC) [1], integrated passive devices (IPD) [2], and thin-film processing on alumina substrate [3]. Thin-film processes usually only have a single patterned layer over a ground plane layer, i.e., the passive structure such as an antenna is on top of a silicon, alumina or quartz substrate Such processes are not feasible for complex integrated systems like phased antenna arrays. The cavity-backed design is beneficial for heat dissipation [12], which may become an issue in future D-band phased antenna arrays due to significant amount of power dissipated on a small PCB area. For D-band frequencies (110-170 GHz), cavity-backed patch antenna arrays on PCB were presented in [7], [20], [21]. We present D-band patch antenna and 4×4 array designs on a cost-effective and low-loss multilayer build up which can be manufactured using PCB processing techniques.
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