Abstract
The sputter-deposition method is successfully used for preparing amorphous AlTi alloys in a wide composition range from about 31 at% to 60 at% Ti. They are spontaneously passive in a chloride-containing neutral borate-boric acid solution showing 400–600 mV higher open circuit potentials than aluminum metal. They possess a better resistance against pitting corrosion, in comparison with the aluminum metal and crystalline AlTi alloys. The cationic composition of the passive film is not greatly different from the bulk alloy composition. No remarkable enrichment of titanium cation in the passive film seems responsible for suffering from pitting corrosion.
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