Abstract
Partial transient liquid-phase (PTLP) bonding has been explored for joining ceramic-ceramic or ceramic-metal couples in recent years. This can produce heat resistant joints at substantially lower temperatures than those required for conventional joining approaches [1±5]. Recent work by Iino [1, 2] has shown that Si3N4 ceramic was successfully bonded to metal Ni by using Ti foil, where partial transient liquid-phase was formed at the Ti=Ni interface at ®rst, then the liquidphase disappeared by the interdiffusion of Ti and Ni atoms. Although suf®cient bonding strength has been obtained, the compressive stress (20 MPa) applied has reached the pressure for solid-state diffusion bonding, and the brittle compound Ni3Ti, which could reduce the joint strength formed in the joint because of the intensive interaction between Ti and Ni atoms. In this letter, a Cu foil was inserted between the Ti foil and Ni sheet. The phase diagram of Ti and Cu is similar to that of Ti and Ni [6], Cu-Ti liquid-phase also can be formed at the Ti=Cu interface. According to [7], the maximum liquid with Wmax can be calculated using the relation W0rTiC (Wmax y W0)rCuC La W0rTiC La
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