Abstract
Abstract As the application of power electronic components in renewable and green energy technologies continues to increase, there is an increasing trend in the utilization of higher voltage and frequency levels. This shift may result in more frequent partial discharge (PD) phenomena that can accelerate the degradation of insulation materials and shorten the lifespan of the components. Therefore, it is critical to ensure the reliability and durability of these components. This study investigated the effects of voltage magnitude and frequency on the PD and insulation degradation of printed circuit board (PCB) samples. Five different test samples were fabricated using a PCB as the substrate and an epoxy resin as the insulating coating. Two distinct testing configurations were employed: one for assessments based on a commercial frequency (60 Hz) and the other for assessments based on a high frequency (600 Hz). This study examined the behavior of PD within PCBs and the resulting insulation deterioration. The results demonstrated that all the samples exhibited significantly lower PD inception voltages (PDIV) at high frequencies compared with those at the commercial frequency. Specifically, the maximum decrease in the PDIV observed was 5 kV, while the minimum reduction was 3.3 kV. These findings highlight the critical impact of frequency on the PD behavior and underscore the importance of understanding these effects to enhance the reliability of electronic components in high-frequency applications.
Published Version
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