Parametric study of thermally induced warpage of FpBGA package using finite element methods

Abstract

Warpage is considered to be the major concern in ensuring the reliability and manufacturability of electronic package because a flat package is crucial for a successful formation of board level assembly process. Warpage is the out of plane displacement which is a resultant of difference in co-efficient of thermal expansion (CTE) between the adjoining packaging materials. Enormous warpage may lead to occurrence of faulty joints such as open connections, mis-shaped joints, and loss of package board-level reliability under manufacturing, thermal loading process, shock and vibration. In this paper, a Fine pitch ball grid array Package (FpBGA) which is a prominent type of electronic package offering solution for downsizing of electronic components such as mobiles and camcorders has been choose for study. Warpage of FpBGA was simulated from post cure temperature to reflow temperature using Finite Element Methods. A static thermal analysis was carried out using ABAQUS software and a parametric study was done to investigate the effect of material properties and geometric properties in minimizing the warpage. Materials properties such as CTE, Elastic modulus of substrate and die, geometric properties like thickness of die and substrate were chosen for study.