Abstract
Drop test simulations of fine-pitch ball grid array (FBGA) package at the board level with an applied acceleration method have been developed. Dynamic response of the test board and FBGA package is investigated parametrically using finite element analysis (FEA) software called ANSYS/LSDYNA. Several dynamic parameters such as acceleration curve, displacement, and velocity of the drop test printed circuit board (PCB) and FBGA package during impact process are investigated. The solder ball material behavior was a bilinear plasticity. Varying solder ball diameter and using a range of generic epoxy underfill materials were found to affect the impact performance of the package. The solder ball’s accumulated plastic strain was monitored to provide package design guidelines for optimization purposes.
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